COURSES

Program Overview

Packaging technology is a fundamental and critical technology for current and next-generation electronics. Its role in India’s recent semiconductor fabrication roadmap will be massive. It will also require a steady stream of well-trained professionals and researchers. The curriculum of this program covers all the important and interdisciplinary aspects of the current state of the art in packaging technology. Various specific domains - automotive, biomedical, communications, and flexible electronics - will be covered. The latest laboratory equipment will back the program.

The "Integrated Circuits and Microsystems Packaging" program is tuned to cater to this interdisciplinary need with leading-edge instruction and exposure to technology.Currently, IIT Hyderabad offers a "2 years M.Tech post-graduate program" in this interdisciplinary field.

Eligible Branches-

● B.Tech/B.E in ECE, EEE, EIE

● B.Tech/B.E ME

● B.Tech/B.E MSME

● Any equivalent 4 -year Undergraduate degree in Electrical, Mechanical and Materials Engineering

Courses offered

CORE COURSES

Electronic Package Design (IP5030)
Heat Transfer in Electronic Packaging (IP5040)
Fatigue and Fracture in Electronic Packaging (IP5010)
Fundamentals of Electronic Packaging Materials (IP5020)
VLSI Technology (EE5182)
IC Assembly, Packaging Design and Characterization Lab (IP5011)
Experimental Stress Analysis Lab (IP5021)

ELECTIVE COURSES(Courses are organised into baskets, and students must select one or two courses from each basket based on their area of interest.)

Fundamentals of Semiconductor Materials (SD5010)
Smart Material and Transducers (IS5010)
Computational Modelling Techniques (IS5030)
Analog IC Design (EE5183)
Introduction to VLSI Design (EE5184)
System design lab (EE5185)
Finite Element Analysis (CE6130)
Nanoelectronics: Principles and Devices (EE6120)
Semiconductor Devices (SD5030)
Digital IC Design
Digital IC Design Lab
Analog IC Design Lab