ICMP VISION

For many years, system integration was driven by System on Chip (SoC) technologies, leading to larger SoCs with scaled devices. With the move towards heterogeneous integration, we see a need for integration that goes far beyond Multi-chip modules (MCM), System in Package (SIP) and 3D Stacks and provides attributes not attainable with such technologies. Our vision is, therefore, to develop the next generation of SoP technologies that merge the package and board together, contain embedded functionality covering multiple signalling domains, and provides a seamless interface to SoC that can be assembled on both sides or embedded in the package and is highly reliable. We see such a heterogeneously integrated system module as a means to continue Moore’s law.